HDI
Line and Space: HDI PCBs typically have smaller trace and spacing widths with sizes as small as 0.002, 0.003, or 0.004 inches (50, 75, 100 microns). Most manufacturers use laser direct imaging (LDI) and vacuum Develop-Etch-Strip (DES) lines to etch fine patterns.
Vias: Laser-drilled micro-vias and buried vias are used to increase the number of interconnections required for modern low-pitch BGA component density.
Layer Count: Reduced layer distance used in most HDI PCBs helps to reduce the PCB thickness and weight of the final product.
PCB Material: We normally recommend using mid or high Tg. material for HDI PCBs. Many applications with controlled trace impedances require special high-speed materials with low dissipation factor (Df) & low relative dielectric constant (εr Dk)
Surface Finish: For the assembly of an HDI PCB, a flat solder pad surface with good solderability is required. The most common finishes used are OSP ENIG, ENEPIG, and Immersion Sn.
Vias: Laser-drilled micro-vias and buried vias are used to increase the number of interconnections required for modern low-pitch BGA component density.
Layer Count: Reduced layer distance used in most HDI PCBs helps to reduce the PCB thickness and weight of the final product.
PCB Material: We normally recommend using mid or high Tg. material for HDI PCBs. Many applications with controlled trace impedances require special high-speed materials with low dissipation factor (Df) & low relative dielectric constant (εr Dk)
Surface Finish: For the assembly of an HDI PCB, a flat solder pad surface with good solderability is required. The most common finishes used are OSP ENIG, ENEPIG, and Immersion Sn.
HDI
Line and Space: HDI PCBs typically have smaller trace and spacing widths with sizes as small as 0.002, 0.003, or 0.004 inches (50, 75, 100 microns). Most manufacturers use laser direct imaging (LDI) and vacuum Develop-Etch-Strip (DES) lines to etch fine patterns.
Vias: Laser-drilled micro-vias and buried vias are used to increase the number of interconnections required for modern low-pitch BGA component density.
Layer Count: Reduced layer distance used in most HDI PCBs helps to reduce the PCB thickness and weight of the final product.
PCB Material: We normally recommend using mid or high Tg. material for HDI PCBs. Many applications with controlled trace impedances require special high-speed materials with low dissipation factor (Df) & low relative dielectric constant (εr Dk)
Surface Finish: For the assembly of an HDI PCB, a flat solder pad surface with good solderability is required. The most common finishes used are OSP ENIG, ENEPIG, and Immersion Sn.
Vias: Laser-drilled micro-vias and buried vias are used to increase the number of interconnections required for modern low-pitch BGA component density.
Layer Count: Reduced layer distance used in most HDI PCBs helps to reduce the PCB thickness and weight of the final product.
PCB Material: We normally recommend using mid or high Tg. material for HDI PCBs. Many applications with controlled trace impedances require special high-speed materials with low dissipation factor (Df) & low relative dielectric constant (εr Dk)
Surface Finish: For the assembly of an HDI PCB, a flat solder pad surface with good solderability is required. The most common finishes used are OSP ENIG, ENEPIG, and Immersion Sn.
Rigid-Flex
Base Material: The most common material choice for the rigid layers is FR4, but other rigid materials like woven glass Polyimide can also be used.
Flexible Area: The flexible area is made of PI Kapton Polyimide material. The Cu is glued to the PI core material using mainly Acrylic or Polyimide adhesive (also called adhesive less).
Lines and spaces: Standard 100um minimum, advance down to 30um.
Vias: Rigid-Flex can contain PTH, blind vias, buried vias and Laser drilled micro-vias.
Layer Count: Up to24 layers
Surface Finish: ENIG (Electroless Nickel Immersion Gold) or HASL (Hot Air Solder Leveling)
Solder Mask: Liquid photo imageable Solder mask can be used in rigid areas. PI Coverlay or Flexible solder mask lacquer can be used in the flexible areas.
Flexible Area: The flexible area is made of PI Kapton Polyimide material. The Cu is glued to the PI core material using mainly Acrylic or Polyimide adhesive (also called adhesive less).
Lines and spaces: Standard 100um minimum, advance down to 30um.
Vias: Rigid-Flex can contain PTH, blind vias, buried vias and Laser drilled micro-vias.
Layer Count: Up to24 layers
Surface Finish: ENIG (Electroless Nickel Immersion Gold) or HASL (Hot Air Solder Leveling)
Solder Mask: Liquid photo imageable Solder mask can be used in rigid areas. PI Coverlay or Flexible solder mask lacquer can be used in the flexible areas.
Rigid-Flex
Base Material: The most common material choice for the rigid layers is FR4, but other rigid materials like woven glass Polyimide can also be used.
Flexible Area: The flexible area is made of PI Kapton Polyimide material. The Cu is glued to the PI core material using mainly Acrylic or Polyimide adhesive (also called adhesive less).
Lines and spaces: Standard 100um minimum, advance down to 30um.
Vias: Rigid-Flex can contain PTH, blind vias, buried vias and Laser drilled micro-vias.
Layer Count: Up to24 layers
Surface Finish: ENIG (Electroless Nickel Immersion Gold) or HASL (Hot Air Solder Leveling)
Solder Mask: Liquid photo imageable Solder mask can be used in rigid areas. PI Coverlay or Flexible solder mask lacquer can be used in the flexible areas.
Flexible Area: The flexible area is made of PI Kapton Polyimide material. The Cu is glued to the PI core material using mainly Acrylic or Polyimide adhesive (also called adhesive less).
Lines and spaces: Standard 100um minimum, advance down to 30um.
Vias: Rigid-Flex can contain PTH, blind vias, buried vias and Laser drilled micro-vias.
Layer Count: Up to24 layers
Surface Finish: ENIG (Electroless Nickel Immersion Gold) or HASL (Hot Air Solder Leveling)
Solder Mask: Liquid photo imageable Solder mask can be used in rigid areas. PI Coverlay or Flexible solder mask lacquer can be used in the flexible areas.
Aluminium
Thermal conductivity: Aluminum has a much higher thermal conductivity compared to traditional PCB materials, typically in the range of 1-2 W/m-K. Dielectric materials with thermal conductivity up to 7W/m-K are available upon request.
Thickness: Aluminum PCBs are available in thicknesses from 0,3mm to 3.0mm. (Special up to 5mm) Copper thickness: The base copper can range from 1 to 3 oz (35um – 105um).
Surface finish: Common surface finishes for aluminum IMS PCBs are LF HASL, immersion Sn and ENIG.
PCB laminate: Most Alu IMS boards are single-sided. Since Alu is an electrically conductive metal, an electrical insulating and thermally conductive dielectric is placed between the Cu and the Alu. Production of double-sided and multilayers are possible, but the PTHs must also be insulated from the Alu.
PCB layout: The layout of an aluminum PCB is typically different from a traditional PCB as thermal management needs to be considered.
Thickness: Aluminum PCBs are available in thicknesses from 0,3mm to 3.0mm. (Special up to 5mm) Copper thickness: The base copper can range from 1 to 3 oz (35um – 105um).
Surface finish: Common surface finishes for aluminum IMS PCBs are LF HASL, immersion Sn and ENIG.
PCB laminate: Most Alu IMS boards are single-sided. Since Alu is an electrically conductive metal, an electrical insulating and thermally conductive dielectric is placed between the Cu and the Alu. Production of double-sided and multilayers are possible, but the PTHs must also be insulated from the Alu.
PCB layout: The layout of an aluminum PCB is typically different from a traditional PCB as thermal management needs to be considered.
Aluminium
Thermal conductivity: Aluminum has a much higher thermal conductivity compared to traditional PCB materials, typically in the range of 1-2 W/m-K. Dielectric materials with thermal conductivity up to 7W/m-K are available upon request.
Thickness: Aluminum PCBs are available in thicknesses from 0,3mm to 3.0mm. (Special up to 5mm) Copper thickness: The base copper can range from 1 to 3 oz (35um – 105um).
Surface finish: Common surface finishes for aluminum IMS PCBs are LF HASL, immersion Sn and ENIG.
PCB laminate: Most Alu IMS boards are single-sided. Since Alu is an electrically conductive metal, an electrical insulating and thermally conductive dielectric is placed between the Cu and the Alu. Production of double-sided and multilayers are possible, but the PTHs must also be insulated from the Alu.
PCB layout: The layout of an aluminum PCB is typically different from a traditional PCB as thermal management needs to be considered.
Thickness: Aluminum PCBs are available in thicknesses from 0,3mm to 3.0mm. (Special up to 5mm) Copper thickness: The base copper can range from 1 to 3 oz (35um – 105um).
Surface finish: Common surface finishes for aluminum IMS PCBs are LF HASL, immersion Sn and ENIG.
PCB laminate: Most Alu IMS boards are single-sided. Since Alu is an electrically conductive metal, an electrical insulating and thermally conductive dielectric is placed between the Cu and the Alu. Production of double-sided and multilayers are possible, but the PTHs must also be insulated from the Alu.
PCB layout: The layout of an aluminum PCB is typically different from a traditional PCB as thermal management needs to be considered.
Semi-Flex
Base Material: The base material used in a semi-flex PCB is FR4.
Flexible Area: The flexibility is created either by Z-milling the flex area in the FR4 or by sequential stack-up. The thin FR4 area allows a certain degree of static flexibility, with less than 10 bending cycles.
Lines and Spaces: There are restrictions to minimum trace and spacing widths in the semi-flexible area to ensure trace strength and reliability.
Layer Count: There are no restrictions to the total layer count in an FR4 Semi-Flex PCB, but the flexible part can only hold a maximum of 2 layers.
Surface Finish: All common surface finishes are supported on FR4 Semi-Flex
Solder Mask: The solder mask in the flexible area needs to be either a flexible solder mask or a PI coverlay. Other parts of the circuit board can have a standard liquid solder mask.
Flexible Area: The flexibility is created either by Z-milling the flex area in the FR4 or by sequential stack-up. The thin FR4 area allows a certain degree of static flexibility, with less than 10 bending cycles.
Lines and Spaces: There are restrictions to minimum trace and spacing widths in the semi-flexible area to ensure trace strength and reliability.
Layer Count: There are no restrictions to the total layer count in an FR4 Semi-Flex PCB, but the flexible part can only hold a maximum of 2 layers.
Surface Finish: All common surface finishes are supported on FR4 Semi-Flex
Solder Mask: The solder mask in the flexible area needs to be either a flexible solder mask or a PI coverlay. Other parts of the circuit board can have a standard liquid solder mask.
Semi-Flex
Base Material: The base material used in a semi-flex PCB is FR4.
Flexible Area: The flexibility is created either by Z-milling the flex area in the FR4 or by sequential stack-up. The thin FR4 area allows a certain degree of static flexibility, with less than 10 bending cycles.
Lines and Spaces: There are restrictions to minimum trace and spacing widths in the semi-flexible area to ensure trace strength and reliability.
Layer Count: There are no restrictions to the total layer count in an FR4 Semi-Flex PCB, but the flexible part can only hold a maximum of 2 layers.
Surface Finish: All common surface finishes are supported on FR4 Semi-Flex
Solder Mask: The solder mask in the flexible area needs to be either a flexible solder mask or a PI coverlay. Other parts of the circuit board can have a standard liquid solder mask.
Flexible Area: The flexibility is created either by Z-milling the flex area in the FR4 or by sequential stack-up. The thin FR4 area allows a certain degree of static flexibility, with less than 10 bending cycles.
Lines and Spaces: There are restrictions to minimum trace and spacing widths in the semi-flexible area to ensure trace strength and reliability.
Layer Count: There are no restrictions to the total layer count in an FR4 Semi-Flex PCB, but the flexible part can only hold a maximum of 2 layers.
Surface Finish: All common surface finishes are supported on FR4 Semi-Flex
Solder Mask: The solder mask in the flexible area needs to be either a flexible solder mask or a PI coverlay. Other parts of the circuit board can have a standard liquid solder mask.
Flex
Base Material: The most common base material used to build a Flexible PCB is Polyimide (PI).
It can be used with PTH and is available for the soldering process. PET and PEN can be used for Flexible PCB without soldering needs.
Lines and Spaces: The trace and spacing widths on a Flexible PCB are usually smaller than traditional PCBs to accommodate the limited space and maintain flexibility. A flexible PCB can also be an HDI PCB.
Layer Count: Flexible PCBs can have single-sided, double-sided, and up to 4 layers with a thickness from 25µm to 150µm.
Surface Finish: The surface finish used in Flexible PCBs is usually electroless nickel immersion gold (ENIG).
It can be used with PTH and is available for the soldering process. PET and PEN can be used for Flexible PCB without soldering needs.
Lines and Spaces: The trace and spacing widths on a Flexible PCB are usually smaller than traditional PCBs to accommodate the limited space and maintain flexibility. A flexible PCB can also be an HDI PCB.
Layer Count: Flexible PCBs can have single-sided, double-sided, and up to 4 layers with a thickness from 25µm to 150µm.
Surface Finish: The surface finish used in Flexible PCBs is usually electroless nickel immersion gold (ENIG).
Flex
Base Material: The most common base material used to build a Flexible PCB is Polyimide (PI).
It can be used with PTH and is available for the soldering process. PET and PEN can be used for Flexible PCB without soldering needs.
Lines and Spaces: The trace and spacing widths on a Flexible PCB are usually smaller than traditional PCBs to accommodate the limited space and maintain flexibility. A flexible PCB can also be an HDI PCB.
Layer Count: Flexible PCBs can have single-sided, double-sided, and up to 4 layers with a thickness from 25µm to 150µm.
Surface Finish: The surface finish used in Flexible PCBs is usually electroless nickel immersion gold (ENIG).
It can be used with PTH and is available for the soldering process. PET and PEN can be used for Flexible PCB without soldering needs.
Lines and Spaces: The trace and spacing widths on a Flexible PCB are usually smaller than traditional PCBs to accommodate the limited space and maintain flexibility. A flexible PCB can also be an HDI PCB.
Layer Count: Flexible PCBs can have single-sided, double-sided, and up to 4 layers with a thickness from 25µm to 150µm.
Surface Finish: The surface finish used in Flexible PCBs is usually electroless nickel immersion gold (ENIG).
Back Panel
Line and space: Back panel PCBs often require impedance-controlled traces which typically mean smaller trace and spacing widths with sizes as small as 0.0025, 0.003 or 0.004 inches (62, 75, 100 microns). Most manufacturers use laser direct imaging (LDI) and vacuum Develop-Etch-Strip (DES) lines to etch the fine patterns.
Vias: Vias are mainly mechanical drilled with min. size approximately 0,3mm. Low possible on request.
Layer count: up to 60 layers
PCB material: We normally recommend using mid or high Tg. material for Back-panel PCBs. Many applications with controlled trace impedances, require special high-speed materials with low signal loss dissipation factor (Df) & low epsilon relative, dielectric constant (εr Dk)
Surface finish: The Back-panel surface treatment depends upon the connector assembly method: Press-fit requires HASL, LF HASL or Immersion Sn. THT and SMT technology requires HASL, LF HASL, OSP, ENIG, Immersion Sn or Immersion Ag.
Vias: Vias are mainly mechanical drilled with min. size approximately 0,3mm. Low possible on request.
Layer count: up to 60 layers
PCB material: We normally recommend using mid or high Tg. material for Back-panel PCBs. Many applications with controlled trace impedances, require special high-speed materials with low signal loss dissipation factor (Df) & low epsilon relative, dielectric constant (εr Dk)
Surface finish: The Back-panel surface treatment depends upon the connector assembly method: Press-fit requires HASL, LF HASL or Immersion Sn. THT and SMT technology requires HASL, LF HASL, OSP, ENIG, Immersion Sn or Immersion Ag.
Back Panel
Line and space: Back panel PCBs often require impedance-controlled traces which typically mean smaller trace and spacing widths with sizes as small as 0.0025, 0.003 or 0.004 inches (62, 75, 100 microns). Most manufacturers use laser direct imaging (LDI) and vacuum Develop-Etch-Strip (DES) lines to etch the fine patterns.
Vias: Vias are mainly mechanical drilled with min. size approximately 0,3mm. Low possible on request.
Layer count: up to 60 layers
PCB material: We normally recommend using mid or high Tg. material for Back-panel PCBs. Many applications with controlled trace impedances, require special high-speed materials with low signal loss dissipation factor (Df) & low epsilon relative, dielectric constant (εr Dk)
Surface finish: The Back-panel surface treatment depends upon the connector assembly method: Press-fit requires HASL, LF HASL or Immersion Sn. THT and SMT technology requires HASL, LF HASL, OSP, ENIG, Immersion Sn or Immersion Ag.
Vias: Vias are mainly mechanical drilled with min. size approximately 0,3mm. Low possible on request.
Layer count: up to 60 layers
PCB material: We normally recommend using mid or high Tg. material for Back-panel PCBs. Many applications with controlled trace impedances, require special high-speed materials with low signal loss dissipation factor (Df) & low epsilon relative, dielectric constant (εr Dk)
Surface finish: The Back-panel surface treatment depends upon the connector assembly method: Press-fit requires HASL, LF HASL or Immersion Sn. THT and SMT technology requires HASL, LF HASL, OSP, ENIG, Immersion Sn or Immersion Ag.
Heavy Copper
Base Material: The base material used in a Heavy Copper PCB are often High Tg. FR4, BT epoxy or GPY Polyimide
Thickness: 0.4 mm to 6,35mm
Copper Weight: 4 oz/ft² to 15 oz/ft² – Low qty. and samples up to 20 oz/ft²
Lines and Spaces: Dependent on Cu Weight (thickness)
Vias: Via types to be used depends on the construction and Cu weight.
Layer Count: 2 to 14 layers
Surface Finish: ENIG, HASL, LF HASL, Immersion Ag, Immersion Sn, Galvanic Ni/Au.
Solder Mask: The Cu thickness on outer layer determines the solder mask thickness needed to provide sufficient coverage and protection of the Cu pattern.
Thickness: 0.4 mm to 6,35mm
Copper Weight: 4 oz/ft² to 15 oz/ft² – Low qty. and samples up to 20 oz/ft²
Lines and Spaces: Dependent on Cu Weight (thickness)
Vias: Via types to be used depends on the construction and Cu weight.
Layer Count: 2 to 14 layers
Surface Finish: ENIG, HASL, LF HASL, Immersion Ag, Immersion Sn, Galvanic Ni/Au.
Solder Mask: The Cu thickness on outer layer determines the solder mask thickness needed to provide sufficient coverage and protection of the Cu pattern.
Heavy Copper
Base Material: The base material used in a Heavy Copper PCB are often High Tg. FR4, BT epoxy or GPY Polyimide
Thickness: 0.4 mm to 6,35mm
Copper Weight: 4 oz/ft² to 15 oz/ft² – Low qty. and samples up to 20 oz/ft²
Lines and Spaces: Dependent on Cu Weight (thickness)
Vias: Via types to be used depends on the construction and Cu weight.
Layer Count: 2 to 14 layers
Surface Finish: ENIG, HASL, LF HASL, Immersion Ag, Immersion Sn, Galvanic Ni/Au.
Solder Mask: The Cu thickness on outer layer determines the solder mask thickness needed to provide sufficient coverage and protection of the Cu pattern.
Thickness: 0.4 mm to 6,35mm
Copper Weight: 4 oz/ft² to 15 oz/ft² – Low qty. and samples up to 20 oz/ft²
Lines and Spaces: Dependent on Cu Weight (thickness)
Vias: Via types to be used depends on the construction and Cu weight.
Layer Count: 2 to 14 layers
Surface Finish: ENIG, HASL, LF HASL, Immersion Ag, Immersion Sn, Galvanic Ni/Au.
Solder Mask: The Cu thickness on outer layer determines the solder mask thickness needed to provide sufficient coverage and protection of the Cu pattern.
Multiplayer
Line and space: 0.075mm / 0.075mm. Advanced 0,06mm / 0,06mm.
Layer count: Up to 26 layers. Advanced 42 layers
PCB material: FR4 raw material with high TG, low CTE, halogen-free, Hi-Speed and low loss specifications
Surface finish: OSP, HASL-LF ENIG.
Layer count: Up to 26 layers. Advanced 42 layers
PCB material: FR4 raw material with high TG, low CTE, halogen-free, Hi-Speed and low loss specifications
Surface finish: OSP, HASL-LF ENIG.
Multiplayer
Line and space: 0.075mm / 0.075mm. Advanced 0,06mm / 0,06mm.
Layer count: Up to 26 layers. Advanced 42 layers
PCB material: FR4 raw material with high TG, low CTE, halogen-free, Hi-Speed and low loss specifications
Surface finish: OSP, HASL-LF ENIG.
Layer count: Up to 26 layers. Advanced 42 layers
PCB material: FR4 raw material with high TG, low CTE, halogen-free, Hi-Speed and low loss specifications
Surface finish: OSP, HASL-LF ENIG.
RF / Microwave
Base Material: The base materials used in an RF Microwave PCB are High Performance FR4s, Ceramic Filled Hydrocarbons and PTFEs with woven glass fiber.
Thickness: 0,4 to 2,4mm
Copper Weight: ½oz to 2oz, advanced 3oz.
Lines and Spaces: min. 75um – (Often with specific low etching tolerances)
Layer Count: 1-22 Layers
Surface Finish: OSP, Im Tin, Im silver, ENIG, ENEPIG and Hard or Soft Gold.
Solder Mask: Can be with or without solder mask.
Thickness: 0,4 to 2,4mm
Copper Weight: ½oz to 2oz, advanced 3oz.
Lines and Spaces: min. 75um – (Often with specific low etching tolerances)
Layer Count: 1-22 Layers
Surface Finish: OSP, Im Tin, Im silver, ENIG, ENEPIG and Hard or Soft Gold.
Solder Mask: Can be with or without solder mask.
RF / Microwave
Base Material: The base materials used in an RF Microwave PCB are High Performance FR4s, Ceramic Filled Hydrocarbons and PTFEs with woven glass fiber.
Thickness: 0,4 to 2,4mm
Copper Weight: ½oz to 2oz, advanced 3oz.
Lines and Spaces: min. 75um – (Often with specific low etching tolerances)
Layer Count: 1-22 Layers
Surface Finish: OSP, Im Tin, Im silver, ENIG, ENEPIG and Hard or Soft Gold.
Solder Mask: Can be with or without solder mask.
Thickness: 0,4 to 2,4mm
Copper Weight: ½oz to 2oz, advanced 3oz.
Lines and Spaces: min. 75um – (Often with specific low etching tolerances)
Layer Count: 1-22 Layers
Surface Finish: OSP, Im Tin, Im silver, ENIG, ENEPIG and Hard or Soft Gold.
Solder Mask: Can be with or without solder mask.
Double-sided
PCB Materials: Tg. 130 to 180C°, CTE 40/220 to 60/300ppm, halogen free optionally.
Copper Weight: 1 oz/ft² minimum
Lines and Spaces: low cost 150um, standard 100um, advanced 75um
Vias: Standard 0,3mm, min. 0,15mm
Layer Count: 2-64 layers.
Surface Finish: LF HASL, OSP, Im Tin, Im Silver, ENIG, ENEPIG and Hard or Soft Gold.
Solder Mask: Green, White, Black, Blue, Red, Yellow.
Copper Weight: 1 oz/ft² minimum
Lines and Spaces: low cost 150um, standard 100um, advanced 75um
Vias: Standard 0,3mm, min. 0,15mm
Layer Count: 2-64 layers.
Surface Finish: LF HASL, OSP, Im Tin, Im Silver, ENIG, ENEPIG and Hard or Soft Gold.
Solder Mask: Green, White, Black, Blue, Red, Yellow.
Double-sided
PCB Materials: Tg. 130 to 180C°, CTE 40/220 to 60/300ppm, halogen free optionally.
Copper Weight: 1 oz/ft² minimum
Lines and Spaces: low cost 150um, standard 100um, advanced 75um
Vias: Standard 0,3mm, min. 0,15mm
Layer Count: 2-64 layers.
Surface Finish: LF HASL, OSP, Im Tin, Im Silver, ENIG, ENEPIG and Hard or Soft Gold.
Solder Mask: Green, White, Black, Blue, Red, Yellow.
Copper Weight: 1 oz/ft² minimum
Lines and Spaces: low cost 150um, standard 100um, advanced 75um
Vias: Standard 0,3mm, min. 0,15mm
Layer Count: 2-64 layers.
Surface Finish: LF HASL, OSP, Im Tin, Im Silver, ENIG, ENEPIG and Hard or Soft Gold.
Solder Mask: Green, White, Black, Blue, Red, Yellow.
Single-sided
Base Material: The base materials used in Single Sided PCBs are FR4, CEM-1, CEM-3 (FR1/XPC,).
Thickness: 0.4 mm to 3.2 mm
Copper Weight: 1 to 2 oz/ft² minimum
Lines and Spaces: low cost 200um, minimum 100um
Layer Count: 1
Surface Finish: LF HASL, OSP, Im Tin, Im Silver, ENIG. (Recommended LF HASL or OSP due to price.))
Solder Mask: Green, White, Black, Blue, Red, Yellow.
Thickness: 0.4 mm to 3.2 mm
Copper Weight: 1 to 2 oz/ft² minimum
Lines and Spaces: low cost 200um, minimum 100um
Layer Count: 1
Surface Finish: LF HASL, OSP, Im Tin, Im Silver, ENIG. (Recommended LF HASL or OSP due to price.))
Solder Mask: Green, White, Black, Blue, Red, Yellow.
Single-sided
Base Material: The base materials used in Single Sided PCBs are FR4, CEM-1, CEM-3 (FR1/XPC,).
Thickness: 0.4 mm to 3.2 mm
Copper Weight: 1 to 2 oz/ft² minimum
Lines and Spaces: low cost 200um, minimum 100um
Layer Count: 1
Surface Finish: LF HASL, OSP, Im Tin, Im Silver, ENIG. (Recommended LF HASL or OSP due to price.))
Solder Mask: Green, White, Black, Blue, Red, Yellow.
Thickness: 0.4 mm to 3.2 mm
Copper Weight: 1 to 2 oz/ft² minimum
Lines and Spaces: low cost 200um, minimum 100um
Layer Count: 1
Surface Finish: LF HASL, OSP, Im Tin, Im Silver, ENIG. (Recommended LF HASL or OSP due to price.))
Solder Mask: Green, White, Black, Blue, Red, Yellow.
Ic substrate
Line and space: 30/30µm (advanced 20/20µm)
Vias: 50µm Laser defined.
Layer count: 2 to 6, advanced – 6+
PCB material: BT resin, Bismaleimide Triazine
Vias: 50µm Laser defined.
Layer count: 2 to 6, advanced – 6+
PCB material: BT resin, Bismaleimide Triazine
Ic substrate
Line and space: 30/30µm (advanced 20/20µm)
Vias: 50µm Laser defined.
Layer count: 2 to 6, advanced – 6+
Material and others: BT resin, Bismaleimide Triazine
Vias: 50µm Laser defined.
Layer count: 2 to 6, advanced – 6+
Material and others: BT resin, Bismaleimide Triazine
Do you have any questions? Contact us!
