The right material, stack-up and via structure in combination with controlled impedance enable RF and MV designs to minimize signal return loss, noise and crosstalk.
Speed and Adapted Impedance
The low-loss tangent allows high-frequency signals to travel fast through the PCB with controlled impedance. RF and MV designs must avoid return signal seeking the route with the least inductance.
Cost-Effective
Hybrid or Mixed dielectric stack-ups combining FR4 with Low loss & Low dielectric constant materials are often used for RF and MV boards to lower the cost.
High Stability
PCB structure is extremely stable in high-temperature environments. If used in analog applications, these PCBs can operate at 40 GHz.
Components
With mixed dielectric stack-ups and with the use of Blind and Buried via structures it is possible to integrate RF/MV with analog and digital signals and components.
RF microwave PCBs are a specialized type of PCBs designed to handle high-frequency signals in the RF and microwave frequency range with minimal signal loss and maximum signal integrity. They are used in a wide range of electronic applications such as wireless communication systems, satellite communication systems, radar systems, and other high-frequency electronic systems. Their design and production require specialized knowledge and experience to ensure the expected performance.
Base Material: The base materials used in an RF Microwave PCB are High Performance FR4s, Ceramic Filled Hydrocarbons and PTFEs with woven glass fiber. Thickness: 0,4 to 2,4mm Copper Weight: ½oz to 2oz, advanced 3oz. Lines and Spaces: min. 75um – (Often with specific low etching tolerances) Layer Count: 1-22 Layers Surface Finish: OSP, Im Tin, Im silver, ENIG, ENEPIG and Hard or Soft Gold. Solder Mask: Can be with or without solder mask.
With the advancement of electronic technology, the requirement of consumers and factories are more demanding every day. The PCB manufacturers must significantly increase the capacities of their products to accommodate this progress and always provide more potential to the R&D departments. Modern Radiofrequency/Microwave boards are pushing the limits of contemporary electronics
An RF (Radio Frequency) Microwave PCB (Printed Circuit Board) is a type of PCB designed to handle high-frequency signals in the RF and microwave frequency range, typically between 1 MHz and 100 GHz. These PCBs are used in a wide range of electronic applications such as wireless communication systems, satellite communication systems, radar systems, and other high-frequency electronic systems.
RF microwave PCBs are a specialized type of PCBs designed to handle high-frequency signals in the RF and microwave frequency range with minimal signal loss and maximum signal integrity. They are used in a wide range of electronic applications such as wireless communication systems, satellite communication systems, radar systems, and other high-frequency electronic systems. Their design and production require specialized knowledge and experience to ensure the expected performance.
Base Material: The base materials used in an RF Microwave PCB are High Performance FR4s, Ceramic Filled Hydrocarbons and PTFEs with woven glass fiber. Thickness: 0,4 to 2,4mm Copper Weight: ½oz to 2oz, advanced 3oz. Lines and Spaces: min. 75um – (Often with specific low etching tolerances) Layer Count: 1-22 Layers Surface Finish: OSP, Im Tin, Im silver, ENIG, ENEPIG and Hard or Soft Gold. Solder Mask: Can be with or without solder mask.
With the advancement of electronic technology, the requirement of consumers and factories are more demanding every day. The PCB manufacturers must significantly increase the capacities of their products to accommodate this progress and always provide more potential to the R&D departments. Modern Radiofrequency/Microwave boards are pushing the limits of contemporary electronics
An RF (Radio Frequency) Microwave PCB (Printed Circuit Board) is a type of PCB designed to handle high-frequency signals in the RF and microwave frequency range, typically between 1 MHz and 100 GHz. These PCBs are used in a wide range of electronic applications such as wireless communication systems, satellite communication systems, radar systems, and other high-frequency electronic systems.
Industries
Automotive
Top Automotive brands choose ICPRUS to match and exceed the high quality and logistics demands of their industry.
Layer count;Up to 18 layers.
Technology highlights;High definition at track and copper layout with tight impedance control. Edge plating and cavity plating and constellation option.
Materials;Low loss and low Dk modified FR4, PTFE, Hydrocarbon. Mixt raw material stack-up option.
Base Copper Thickness;From 1/3 Oz base to 3 Oz
Minimum track & spacing;0.060mm / 0.060mm
Surface finishes available;OSP, ENIG, ENEPIG, Soft-Gold, Gold fingers, Immersion Tin, Immersion Silver.
Minimum mechanical drill;0.125mm
PCB thickness;0.40mm – 3,2mm
Maximum dimensions;425x590mm.