Aratek biometric solutions
streamlines identity
management for millions
streamlines identity
management for millions
Product Benefits
HDI improves the fan out and reduces the signal path length. HDI removes via stubs, reduces reflections of signals, and thus improves signal quality.
Cost-Effective
Although the square meter price is higher for HDI PCBs, the superior signal integrity, higher reliability, and space, weight, and layer savings make HDI PCBs a cost-effective quality solution.
Aratek biometric solutions
streamlines identity
management for millions
streamlines identity
management for millions
High Reliability
Laser-drilled micro-vias have less chance of manufacturing mistakes and interconnecting defects during PCB production compared with conventional via PTHs (plated through holes). The micro-vias are also less affected by CTE (Coefficient of Thermal Expansion) during the assembly process.
Better Signal Integrity
HDI helps in placing the components closer to each other which cuts down the signal path length. HDI removes via stubs, reduces reflections of signals, and thus improves signal quality.
Aratek biometric solutions
streamlines identity
management for millions
streamlines identity
management for millions
HDI – High-Density Interconnect. There are many different definitions of HDI technology. Common for all HDI boards is the use of smaller trace & space and micro-vias to create higher wiring routing density than a conventional PCB.
Aratek biometric solutions
streamlines identity
management for millions
streamlines identity
management for millions
Line and Space: HDI PCBs typically have smaller trace and spacing widths with sizes as small as 0.002, 0.003, or 0.004 inches (50, 75, 100 microns). Most manufacturers use laser direct imaging (LDI) and vacuum Develop-Etch-Strip (DES) lines to etch fine patterns.
Vias: Laser-drilled micro-vias and buried vias are used to increase the number of interconnections required for modern low-pitch BGA component density.
Layer Count: Reduced layer distance used in most HDI PCBs helps to reduce the PCB thickness and weight of the final product.
PCB Material: We normally recommend using mid or high Tg. material for HDI PCBs. Many applications with controlled trace impedances require special high-speed materials with low dissipation factor (Df) & low relative dielectric constant (εr Dk)
Surface Finish: For the assembly of an HDI PCB, a flat solder pad surface with good solderability is required. The most common finishes used are OSP ENIG, ENEPIG, and Immersion Sn.
Vias: Laser-drilled micro-vias and buried vias are used to increase the number of interconnections required for modern low-pitch BGA component density.
Layer Count: Reduced layer distance used in most HDI PCBs helps to reduce the PCB thickness and weight of the final product.
PCB Material: We normally recommend using mid or high Tg. material for HDI PCBs. Many applications with controlled trace impedances require special high-speed materials with low dissipation factor (Df) & low relative dielectric constant (εr Dk)
Surface Finish: For the assembly of an HDI PCB, a flat solder pad surface with good solderability is required. The most common finishes used are OSP ENIG, ENEPIG, and Immersion Sn.
Aratek biometric solutions
streamlines identity
management for millions
streamlines identity
management for millions
HDI is a necessity when the component pitch requires it, or the board size demands it. When properly designed, HDI PCBs are smaller, thinner, and weigh less (board downsizing trend). HDI has a myriad of constructions and variables that all affect density. To understand how blind vias, skip vias, staggered vias, stacked vias, and buried vias contribute to density, you must do a “routing test” and play with all these different stack-ups and constructions. By measuring the metrics (inches/square inch and pins/square inch), you can create a table that relates these density measures to the corresponding construction.
HDI PCB design techniques are used when considering the need to mount extreme component density on a limited board size. The component density determines the number of connections per square inch of the board. If the connections of all the parts and test points divided by the size of the board are less than 120 — 130 pins per square inch, there is no need to be using HDI, unless the use of specific dense BGA requires HDI to facilitate all connections. HDI technology has revolutionized the electronics industry and is used in most electronic gadgets you know. The demand for Printed Circuit Board using HDI technology looks promising for many various industries.
Aratek biometric solutions
streamlines identity
management for millions
streamlines identity
management for millions
HDI – High-Density Interconnect. There are many different definitions of HDI technology. Common for all HDI boards is the use of smaller trace & space and micro-vias to create higher wiring routing density than a conventional PCB.
Aratek biometric solutions
streamlines identity
management for millions
streamlines identity
management for millions
Line and Space: HDI PCBs typically have smaller trace and spacing widths with sizes as small as 0.002, 0.003, or 0.004 inches (50, 75, 100 microns). Most manufacturers use laser direct imaging (LDI) and vacuum Develop-Etch-Strip (DES) lines to etch fine patterns.
Vias: Laser-drilled micro-vias and buried vias are used to increase the number of interconnections required for modern low-pitch BGA component density.
Layer Count: Reduced layer distance used in most HDI PCBs helps to reduce the PCB thickness and weight of the final product.
PCB Material: We normally recommend using mid or high Tg. material for HDI PCBs. Many applications with controlled trace impedances require special high-speed materials with low dissipation factor (Df) & low relative dielectric constant (εr Dk)
Surface Finish: For the assembly of an HDI PCB, a flat solder pad surface with good solderability is required. The most common finishes used are OSP ENIG, ENEPIG, and Immersion Sn.
Vias: Laser-drilled micro-vias and buried vias are used to increase the number of interconnections required for modern low-pitch BGA component density.
Layer Count: Reduced layer distance used in most HDI PCBs helps to reduce the PCB thickness and weight of the final product.
PCB Material: We normally recommend using mid or high Tg. material for HDI PCBs. Many applications with controlled trace impedances require special high-speed materials with low dissipation factor (Df) & low relative dielectric constant (εr Dk)
Surface Finish: For the assembly of an HDI PCB, a flat solder pad surface with good solderability is required. The most common finishes used are OSP ENIG, ENEPIG, and Immersion Sn.
HDI is a necessity when the component pitch requires it, or the board size demands it. When properly designed, HDI PCBs are smaller, thinner, and weigh less (board downsizing trend). HDI has a myriad of constructions and variables that all affect density. To understand how blind vias, skip vias, staggered vias, stacked vias, and buried vias contribute to density, you must do a “routing test” and play with all these different stack-ups and constructions. By measuring the metrics (inches/square inch and pins/square inch), you can create a table that relates these density measures to the corresponding construction.
HDI PCB design techniques are used when considering the need to mount extreme component density on a limited board size. The component density determines the number of connections per square inch of the board. If the connections of all the parts and test points divided by the size of the board are less than 120 — 130 pins per square inch, there is no need to be using HDI, unless the use of specific dense BGA requires HDI to facilitate all connections. HDI technology has revolutionized the electronics industry and is used in most electronic gadgets you know. The demand for Printed Circuit Board using HDI technology looks promising for many various industries.
Aratek biometric solutions
streamlines identity
management for millions
streamlines identity
management for millions
Industries
Aratek biometric solutions
streamlines identity
management for millions
streamlines identity
management for millions
Industries
Automotive
Top Automotive brands choose ICPRUS to match and exceed the high quality and logistics demands of their industry.
Medical
An ever-increasing amount of companies in the medical industry rely on the Precision from ICPRUS.
Industry
The Industrial Automation sector benefits from ICPRUS’s intimate understanding of the complexity of automation and robotics.
Consumer &
Multimedia
Multimedia
The Industrial Automation sector benefits from ICPRUS’s intimate understanding of the complexity of automation and robotics.
Aerospace
ICPRUS is growing in the aerospace industry because of the benefits offered by our expert services and one-stop solutions.
Metering
With ultra-modern laboratories and equipment, ICPRUS guarantees long product life and high quality.
Aratek biometric solutions
streamlines identity
management for millions
streamlines identity
management for millions
Technical Data
Aratek biometric solutions
streamlines identity
management for millions
streamlines identity
management for millions
Technical Data
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